More

The HBAC4A03C-MC1HT is part of Samsung‘s HBM3 (High Bandwidth Memory 3rd Generation) series, which utilizes an innovative stacked package design that stacks multiple on-chip stacked memory chips together to achieve ultra-high bandwidth and capacity. This product is designed to meet the demand for high-speed, high-capacity memory in areas such as high-performance computing, graphics processing and artificial intelligence.

Technical Features

High bandwidth: The KHBAC4A03C-MC1HT has an impressive bandwidth that can reach data transfer speeds of thousands of gigabytes per second, which gives it a significant advantage when processing large amounts of data.

High-speed DRAM: The product utilizes 12-layer high-speed DRAM stacking technology to further enhance data transfer speed and energy efficiency.

Large Capacity: With the stacked package design, the KHBAC4A03C-MC1HT realizes a larger storage capacity to meet the storage capacity requirements of high-performance applications.

High Energy Efficiency: Compared with traditional DDR memory, the KHBAC4A03C-MC1HT also offers a significant improvement in energy efficiency, which helps to prolong the usage time of the device and reduce energy consumption.

Application Areas

High-performance computing: The high bandwidth and large capacity of the KHBAC4A03C-MC1HT make it widely used in high-performance computing, which can significantly improve computational efficiency and speed.

Graphics Processing: In graphics processing, the product can handle more complex rendering tasks and enhance the realism and smoothness of virtual reality and augmented reality applications.

Artificial Intelligence: The KHBAC4A03C-MC1HT‘s high-speed data transfer capability makes it ideal for AI applications, speeding up model training and inference.

Product Specifications

Speed: 6.4 Gbps (transfer rate per second)

Density: 24 Gb (storage capacity)

Composition: 1024 memory cells (or chips)

Refresh Time: 32 ms (memory refresh cycle)

Package type: MPGA (may refer to a specific memory packaging technology)

Cautions

Compatibility: When purchasing and using KHBAC4A03C-MC1HT, please make sure that it is compatible with your system or equipment.

Heat Dissipation Requirements: Since HBM has high requirements on packaging and heat dissipation, you need to pay attention to heat dissipation when using this product to ensure its long-term stable operation.

To summarize, Samsung product KHBAC4A03C-MC1HT is a high-performance, high-bandwidth, high-capacity memory product for high-performance computing, graphics processing and artificial intelligence.