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ADI Chip Naming Rules

Time:2023-09-09 Views:291
ADI  Common Product Model Nomenclature
        Monolithic and Hybrid Integrated Circuits
                x x x x x x x x 
                 1 2 3 4 5
        1. Prefix:
      AD Analog Devices HA Hybrid Integrated A/D HD Hybrid Integrated D/A 
        2. Device Model Number 
        3. General Description: A second generation, DI dielectric isolated, Z operating at ±12V 
        4. Temperature range/performance (listed in order of increasing parameter performance):
              I, J, K, L, M 0°C to 70°C
              A, B, C -25°C or -40°C to 85°C
              S, T, U -55°C to 125°C  
        5. Package form:
            D Ceramic or metal sealed dual in-line R miniature "SQ" package
            E Ceramic Leadless Chip Carrier RS Reduced Miniature Package 
            F Ceramic Flatpacks S Plastic four-sided leaded flatpacks      
            G Ceramic Pin Arrays ST Thin Quad Flatpacks
            H Hermetically Sealed Metal Tube Cap T TO-92 Type Package         
            J J-Lead Ceramic Packages U Thin Micro Packages
            M Ceramic Metal Cap Dual In-Line W Unsealed Ceramic/Glass Dual In-Line
            N Leaded Chip Carrier Y Single In-Line          
            Q Ceramic Fusion-Sealed Dual In-Line Z Ceramic Leaded Chip Carrier 
            P Plastic or Epoxy Sealed Dual Inline  
        High Precision Monolithic Devices
                XXX XXXX BI E X /883 
                                      1 2 3 4 5 6 
        1. Device Classification: ADC A/D Converter OP Operational Amplifier
               AMP Device Amplifier PKD Peak Monitor
               BUF Buffers PM PMI Secondary Power Products
               CMP Comparator REF Voltage Comparator
               DAC D/A Converter RPT PCM Line Repeater 
               JAN Mil-M-38510 SMP Sample/Hold Amplifier
               LIU Serial Data Column Interface Unit SW Analog Switch 
               MAT Mating Transistor SSM Sound Products
               MUX Multiplex Modulator TMP Temperature Sensor  
        2. Device Model 
        3. Aging Options 
        4. Electrical ratings 
        5. Package form: 
                 H 6-Leg TO-78 S Miniature Package
           J 8-Leg TO-99 T 28-Leg Ceramic Dual Inline 
           K 10-Leg TO-100 TC 20-Lead End Leadless Chip Carrier
           P Epoxy B Dual In-Line V 20-Leg Ceramic Dual In-Line 
           PC Plastic Leaded Chip Carrier X 18-Leg Ceramic Dual In-line
           Q 16-Leg Ceramic Dual In-Line Y 14-Leg Ceramic Dual In-Line
           R 20-leg ceramic dual in-line Z 8-leg ceramic dual in-line
           RC 20-leg ceramic leadless chip carrier 
        6. Military Processes
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