ADI Chip Naming Rules
Time:2023-09-09
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ADI Common Product Model Nomenclature
Monolithic and Hybrid Integrated Circuits
x x x x x x x x
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1. Prefix:
AD Analog Devices HA Hybrid Integrated A/D HD Hybrid Integrated D/A
2. Device Model Number
3. General Description: A second generation, DI dielectric isolated, Z operating at ±12V
4. Temperature range/performance (listed in order of increasing parameter performance):
I, J, K, L, M 0°C to 70°C
A, B, C -25°C or -40°C to 85°C
S, T, U -55°C to 125°C
5. Package form:
D Ceramic or metal sealed dual in-line R miniature "SQ" package
E Ceramic Leadless Chip Carrier RS Reduced Miniature Package
F Ceramic Flatpacks S Plastic four-sided leaded flatpacks
G Ceramic Pin Arrays ST Thin Quad Flatpacks
H Hermetically Sealed Metal Tube Cap T TO-92 Type Package
J J-Lead Ceramic Packages U Thin Micro Packages
M Ceramic Metal Cap Dual In-Line W Unsealed Ceramic/Glass Dual In-Line
N Leaded Chip Carrier Y Single In-Line
Q Ceramic Fusion-Sealed Dual In-Line Z Ceramic Leaded Chip Carrier
P Plastic or Epoxy Sealed Dual Inline
High Precision Monolithic Devices
XXX XXXX BI E X /883
1 2 3 4 5 6
1. Device Classification: ADC A/D Converter OP Operational Amplifier
AMP Device Amplifier PKD Peak Monitor
BUF Buffers PM PMI Secondary Power Products
CMP Comparator REF Voltage Comparator
DAC D/A Converter RPT PCM Line Repeater
JAN Mil-M-38510 SMP Sample/Hold Amplifier
LIU Serial Data Column Interface Unit SW Analog Switch
MAT Mating Transistor SSM Sound Products
MUX Multiplex Modulator TMP Temperature Sensor
2. Device Model
3. Aging Options
4. Electrical ratings
5. Package form:
H 6-Leg TO-78 S Miniature Package
J 8-Leg TO-99 T 28-Leg Ceramic Dual Inline
K 10-Leg TO-100 TC 20-Lead End Leadless Chip Carrier
P Epoxy B Dual In-Line V 20-Leg Ceramic Dual In-Line
PC Plastic Leaded Chip Carrier X 18-Leg Ceramic Dual In-line
Q 16-Leg Ceramic Dual In-Line Y 14-Leg Ceramic Dual In-Line
R 20-leg ceramic dual in-line Z 8-leg ceramic dual in-line
RC 20-leg ceramic leadless chip carrier
6. Military Processes