On October 28, 2024, Intel announced in Beijing that it will expand Intel‘s Chengdu packaging and testing site. That is, on the basis of the existing packaging test for client products, it will add the provision of packaging test services for server chips and set up a customer solution center to improve the efficiency of the local supply chain, increase the strength of customer support in China, and enhance the speed of response.

Intel said the expansion plan reflects Intel‘s continued deepening and development in Chengdu. Related planning and construction work has already been initiated.

According to the expansion plan of Intel‘s Chengdu base, its new capacity will focus on providing packaging and testing services for server chips in response to Chinese customers‘ demand for energy-efficient and customized packaging solutions. The soon-to-be-established Intel Customer Solutions Center will become a one-stop platform for promoting enterprise digital transformation, working with customers and ecosystem partners to provide industry customers with customized solutions based on Intel architecture and products, and accelerating the landing of industry applications.

Mr. Wang Rui, Senior Vice President of Intel Corporation and Chairman of Intel China, said, “China‘s continuous promotion of high-quality development and high-level opening up to the outside world is the foundation and driving force for Intel‘s long-term development in the Chinese market. Intel‘s strategy of rooting in China and serving customers remains unchanged. The expansion of the Chengdu base will enable Intel to focus more on local needs, integrate resources, respond faster to the digital and green transformation of Chinese customers, and inject new momentum into a sustainable digital economy. As a center city driving high-quality development in western China, Chengdu has a first-class business environment. Intel has been deeply engaged in Chengdu for more than 20 years and is deeply involved in building the local ecosystem and community. We look forward to the expansion of the Chengdu site as a brand new milestone in Intel‘s deepening collaboration with the industry.”

  Intel‘s Chengdu packaging and testing base, located in Chengdu‘s high-tech west district, is one of Intel‘s largest chip packaging and testing centers in the world and has been constructed as one of Intel‘s three major global wafer preprocessing factories, with half of Intel‘s global microprocessors for mobile devices coming from Intel Chengdu at present.

Data show that as early as August 2003, Intel officially announced the construction of Chengdu packaging and testing base. 2004 early, a project - chipset factory in full swing to start construction, successfully completed and put into operation at the end of 2005, its products have been exported to all parts of the world, demonstrating Intel‘s technical strength in the field of packaging and testing; in 2005, the first phase of the project was completed and put into operation, and the products have been exported to all parts of the world, demonstrating the technical strength in the field of packaging and testing. In August 2005, the second phase of the project was launched, and the project was completed on schedule in October 2006, which included a training center that began to serve the skills upgrading of employees; in 2007, the microprocessor factory was officially put into operation, which is responsible for packaging and testing Intel‘s most advanced multi-core microprocessor products, which marks the company‘s production capacity in Chengdu reached a new height, further consolidating the company‘s position in the global semiconductor market. Intel‘s important position in the global semiconductor market. After three capital increases during the period, as of November 2014 the total investment in Intel‘s Chengdu packaging and testing base reached $600 million.

In December 2014, Intel announced that it would invest $1.6 billion in the next 15 years to introduce the latest “high-end test technology” and fully upgrade its Chengdu plant. 2016, the high-end test technology was officially put into production, thus Intel Chengdu plant has fully realized the integration of chip packaging test, wafer preprocessing and high-end test technology in one major “innovation”. In 2016, the high-end test technology was officially put into production, thus Intel Chengdu factory fully realized the major “innovation and wisdom change” of integrating chip packaging test, wafer preprocessing and high-end test technology.

Data show that since the start of Intel Chengdu packaging and testing base in 2003, the total investment has accumulated more than 4 billion U.S. dollars, and successfully shipped nearly 3 billion chips.

At present, Intel‘s Chengdu plant has become Intel‘s global production engine and the first trial production base for new products for mobile devices, and is also an important strategic initiative of Intel in response to the Chinese government‘s “Western Development” policy.

This time, Intel announced a further expansion of Chengdu packaging and testing base, just as Intel is mired in a “financial crisis”, global layoffs of 15,000 people and the suspension of investment in semiconductor manufacturing in Europe, at this time to increase investment in China can be said to be not easy, reflecting the degree of importance that Intel attaches to the Chinese market.

Intel said, looking to the future, Chengdu base will adhere to the core concept of sustainable development, committed to promoting green operations, improve the efficiency of the local supply chain, and actively participate in community building and volunteer activities. Together with its partners and employees, Intel will open a new chapter in providing efficient services to local customers in China.