CASI Kintex-7, the XILINX Advantage Series:
The Kintex-7 family of FPGAs is part of the XILINX 7 series of FPGAs, which also includes the Spartan-7, Artix-7, and Virtex-7 subfamilies.The Kintex-7 family of FPGAs utilizes advanced 28nm HKMG process technology and HPL methodology designed to deliver superior power efficiency and target high-growth applications with performance, power consumption, cost and time-to-market are optimized and packaged.
High price/performance ratio:
The Kintex-7 family of FPGAs can achieve its equivalent performance at less than half the price of the Virtex-6 family, doubling the price/performance ratio.
This series of FPGAs offers high DSP rates, cost-effective packaging, and support for mainstream standards such as PCIe® Gen3 and 10 Gigabit Ethernet.
Superior DSP performance:
An unprecedented 144 GMACS digital signal processor (DSP) is provided, making the versatile Kintex-7 devices an excellent choice for applications such as portable ultrasound equipment and next-generation communications.
The DSP slice enhances the speed and efficiency of many applications beyond digital signal processing, such as wide dynamic bus shifters, memory address generators, wide bus multiplexers and memory-mapped I/O registers.
High-speed connectivity:
Provides up to 800Gbps of peak serial bandwidth (full duplex), including CPRI/OBSAI IP cores optimized for today‘s distributed baseband architectures (9.8Gbps).
Programmable Kintex-7 devices can also be easily reconfigured to support multiple air interfaces such as LTE, WiMAX and WCDMA.
Powerful memory interface:
The 72-bit, 1,833Mbps Kintex-7 memory interface supports a single memory buffer design instead of the two- or four-buffer designs required by other devices.
An industry-leading 1,866Mbps memory interface is provided, along with high-speed LVDS connectivity.
Flexible package options:
The Kintex-7 FPGA family offers a variety of package options to meet the needs of different applications. For example, performance is maximized by offering high signal integrity and up to 32 high-speed GTX transceivers (12.5Gbps line rate) in a conventional flip-chip BGA package.
Bare-chip flip-chip BGA packages with high signal integrity and robust thermal characteristics (up to 6.6Gbps line rate) are also available to minimize cost.
Low Power Design:
The HPL process cuts power consumption in half compared to alternative 28nm high-performance (HP) processes.
A low 1.0V core voltage is available (with a 0.9V core voltage option for some devices), which translates into lower system power consumption, lower cooling requirements, and a “greener” design.
Application Areas:
The Kintex-7 series FPGAs are widely used in a variety of high-end applications, such as 3G/4G wireless, flat panel displays, video over IP solutions, portable radar, ASIC prototyping, and more. Its high performance, low power consumption and cost optimization make it an ideal choice for these areas.
Kintex 7 FPGA Product FamilyXC7K70T XC7K160T XC7K325T XC7K410T XC7K420T XC7K480T
131-2899-0370
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xilinx@casi-ic.com
Elan Tsao